• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

DIN EN IEC 61191-10-2 2025-06-24 Printed board assemblies - Part 10-2: Guideline for the Output Profile Design in Laser-Assisted Bonding More  Comment 
DIN EN IEC 63569 2025-06-05 High-Level Test Description Table for Development of Production Test Programs More  Comment 
DIN EN IEC 62878-2-604 2025-05-22 Device embedding assembly technology - Part 2-604:Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module More  Comment 
DIN EN IEC 61249-2-55 2025-02-13 Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications More  Comment 
DIN EN IEC 61189-5-501 2025-02-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes More  Comment 
DIN EN IEC 61190-1-3 2025-02-04 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications More  Comment 
DIN EN IEC 61189-3-720 2024-12-12 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards More  Comment 
DIN EN IEC 63609-1 2024-11-19 Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant More  Comment 
DIN EN IEC 63609-2 2024-11-19 Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites More  Comment 
DIN EN IEC 63609-3 2024-11-19 Measurement method used in thermal design for electronics assemblies - - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards More  Comment 

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