Project
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
Abstract
This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized test coupon are used for the evaluation. Coupons are conditioned and measurements taken at a high temperature and humidity.
Begin
2025-02-04
Planned document number
DIN EN IEC 61189-5-501
Project number
02232897
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
