Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Abstract
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Begin
2025-02-04
Planned document number
DIN EN IEC 61190-1-3
Project number
02232899
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
