Project
Printed board assemblies - Part 10-2: Guideline for the Output Profile Design in Laser-Assisted Bonding
Abstract
This standard describes a process profile design method used for setting power profile in laser assisted bonding (LAB). This method is mainly applicable to flip chip bonding even though it can be applicable to other areas such as LED bonding and solar cell bonding.
Begin
2025-06-24
Planned document number
DIN EN IEC 61191-10-2
Project number
02233207
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
