DIN - German Institute for Standardization

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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Standards [CURRENT]

OEVE/OENORM EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011) (german version)

Title (German)

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 9: Prüfverfahren zur Festigkeit von Full-Wafer-Bondverbindungen in der Mikrosystemtechnik (MEMS) (IEC 62047-9:2011) (deutsche Fassung)

Edition 2012-05-01

Original language German

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Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture

OEVE/OENORM EN 62047-9 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011) (german version)

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OEVE/OENORM EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011) (german version)