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IEC 50/358/FDIS
IEC 68-2-69: Solderability testing of electronic components for surface mount technology by the wetting balance method
IEC 91/532/NP
Environmental Testing - Part X: Tests - Test: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste
IEC/SC 59F/JWG 4
Wet surface cleaning appliances
IEC/TC 61/WG 40
Fires on dishwashers and other wet household appliances
NA 002-00-15-07 AK
wet abrasion resistance
IEC 91/903/CDV
IEC 60068-2-83 Ed.1: Environmental Testing - Part 2-83: Tests-test Tf: Solderability testing of electronic components forsurface mounting devices (SMD) by the wetting balance method using solder paste
DIN EN IEC 60068-2-83
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 91/1968/CDV:2024); German and English version prEN IEC 60068-2-83:2024
ISO/TC 193/SC 3/WG 5
Wet gas sampling
ISO/TC 193/SC 3/WG 2
Wet Gas measurement
ISO/TC 31/WG 12
Methods for measuring relative wet grip performance
