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4. DKE

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Abstract

This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Begin

2023-11-28

Planned document number

DIN EN IEC 60068-2-83

Project number

02231951

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

draft standard

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 91/1968/CDV:2024); German and English version prEN IEC 60068-2-83:2024
2025-06
Order from DIN Media

previous edition(s)

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011
2012-07