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Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ

Live working - Terminology for tools, devices and equipment

Semiconductor devices - Part 14-12: Semiconductor sensors - Performance test methods for CMOS imager-based gas sensors

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 60747-15:2024); German version EN IEC 60747-15:2024

Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English

Semiconductor devices - Part 16-11: Microwave integrated circuits - Detectors

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2861/CDV:2024); German and English version prEN IEC 60749-7:2024

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024

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