2. Getting involved
3. Standards Committees
4. DKE

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Abstract

This part of DIN EN 60749 specifies a standard test method for determining the solderability of component housing connections which are intended to be connected to other surfaces during component assembly by using tin-lead solders (SnPb solders) or lead-free solders (Pb-free solders).

Begin

2024-07-31

Planned document number

DIN EN IEC 60749-21

Project number

02232469

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

draft standard

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024
2025-04
Order from DIN Media

previous edition(s)

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011
2012-01