Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)
Edition 2013-10

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03

Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods (IEC 49/1401/CD:2022); Text in German and English
Edition 2023-05

Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods (IEC 62276:2016); German version EN 62276:2016
Edition 2017-08

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011) (german version)
Edition 2012-05-01

Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods (IEC 49/1454/CDV) (english version)
Edition 2024-05-01

Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods ( IEC 62276:2016) (german version)
Edition 2017-10-01

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Edition 2011-08

Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods
Edition 2016-12

Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods
Edition 2025-04-25