Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 63215-2:2023); German version EN IEC 63215-2:2023
Edition 2025-03

Test sieves and test sieving - Vocabulary (ISO 2395:1990)
Edition 1999-01

Geometrical product specifications (GPS) - Acceptance and reverification tests for coordinate measuring systems (CMS) - Part 5: Coordinate measuring machines (CMMs) using single and multiple stylus contacting probing systems using discrete point and/or scanning measuring mode (ISO 10360-5:2020); German version EN ISO 10360-5:2020
Edition 2020-11

Industrial screens and screening - Vocabulary (ISO 9045:1990)
Edition 1998-12

International electrotechnical vocabulary - Part 351: Control technology (IEC 60050-351:2013)
Edition 2014-09

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
Edition 2018-10

Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
Edition 1992-04

Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012
Edition 2012-08

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 60747-15:2024); German version EN IEC 60747-15:2024
Edition 2025-08

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003
Edition 2004-05