• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

Document number Begin Title Comment
IEC 52/756/NP 1997-11-14 Proposal of the USNC: Generic computer aided manufacturing format (GenCAM) More  Comment 
IEC 91/119/CD 1997-07-25 IEC 61761: Generic specification - Capability approval for surface mount technologies More  Comment 
IEC 52/732/CDV 1997-06-06 IEC 61193-2: Guidance on the use of IEC/ISO publications and quality assessment systems - Part 2: Guide to the implementation of ISO 9000 quality standards within the IECQ system for printed boards and printed board assemblies More  Comment 
IEC 40/939/NP 1997-05-09 Proposal of the Japanese NC: Packaging of components for automatic handling - Part X: Reusable and/or recyclable plastic reels More  Comment 
IEC 46C/276/CD 1997-02-28 Amendment to IEC 1156-2 for values of characteristic impedance and structural return loss (SRL) and return loss (RL) More  Comment 
IEC 52/677/CD 1996-10-04 IEC 2326-3-1: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C More  Comment 
IEC 52/794/CDV 1996-03-22 Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More  Comment 
IEC 52/795/CDV 1996-03-22 Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures More  Comment 
IEC 91/80/NP 1995-05-05   More  Comment 
IEC 107/106/PAS IEC/PAS 62647-1 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 1: Lead-free management More  Comment 

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