• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

Document number Begin Title Comment
DIN EN IEC 61760-4 2024-11-19 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices More  Comment 
DIN EN IEC 61760-1 2024-08-27 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) More  Comment 
DIN EN IEC 63516 2024-07-03 Fixed folding Durability test method for flexible opto-electric circuit boards More  Comment 
DIN EN IEC 61189-3-303 2024-06-28 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards More  Comment 
DIN EN IEC 61249-2-54 2024-06-28 Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications More  Comment 
DIN EN IEC 60068-2-83 2023-11-28 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 91/1968/CDV:2024); German and English version prEN IEC 60068-2-83:2024 More  Comment 
DIN EN IEC 61249-2-53 2023-11-10 Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad More  Comment 
DIN EN IEC 61189-3-302 2023-08-31 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Computed tomography(CT) method for copper plating voids in metallized holes of PCB More  Comment 
DIN IEC 61249-3-6 2023-08-10 Materials for printed boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials, clad and unclad-PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad More  Comment 
DIN EN IEC 60068-2-88 2023-05-10 Environmental testing - Part 2-88: Tests - Test XD: Resistance of components and assemblies to liquid cleaning media (IEC 91/1964/CDV:2024); German and English version prEN IEC 60068-2-88:2024 More  Comment 

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