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EN 55014-1/prAB
Electromagnetic compatibility - Requirements for houshold appliances, electric tools and similar apparatus - Part 1: Emission - Product family standard - Amendment to CISPR 14-1: Thermostats and room heating appliances
EN 55014-2/prA2
Electromagnetic compatibility - Requirements for household appliances, electric tools and similar apparatus - Part 2: Immunity - Product family standard
IEC 47D/112/CD
Proposal for a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2
IEC 47D/214/NP
Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2)
IEC 47D/314/CD
Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2)
IEC 47D/435/FDIS
IEC 60191-2, F41, Ed.1: Proposal for a supplement of QFN outline drawings to the outline family of 102E
IEC 47D/523/NP
Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie
IEC 47D/539/NP
Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch
IEC 47D/539A/NP
RESUBMISSION: Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch (ex 47D/539/NP)
IEC 47D/540/NP
Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts
