Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods

Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods

IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods

IEC 60512-16-18 Ed.1: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - Part 16-18: Mechanical tests on contacts and terminations - Test 16r: Deflection of male contacts in a connector insert by simulation

Test method for fibre-reinforced cementitious composites - Load-deflection curve using circular plates

Plastics - Determination of temperature of deflection under load - Part 3: High-strength thermosetting laminates and long-fibre-reinforced plastics

Plastics - Determination of temperature of deflection under load - Part 3: High-strength thermosetting laminates and long-fibre-reinforced plastics (ISO/FDIS 75-3:2025)

Glass-reinforced thermosetting plastics (GRP) pipes - Determination of the long-term ultimate bending strain and the long-term ultimate relative ring deflection under wet conditions

Plastics - Determination of temperature of deflection under load - Part 3: High-strength thermosetting laminates and long-fibre-reinforced plastics (ISO/FDIS 75-3:2025); German and English version FprEN ISO 75-3:2025