Founding - Ultrasonic testing - Part 4: Phased array ultrasonic testing of steel castings; German and English version prEN 12680-4:2025

Determination of certain substances in electrotechnical products - Part 13: Bisphenol A in plastics by liquid chromatography-diode array detection (LC-DAD), liquid chromatography-mass spectrometry (LC-MS) and liquid chromatography-tandem mass spectrometry (LC-MS/MS) (IEC 111/799/CDV:2025); German and English version prEN IEC 62321-13:2025

Non-destructive testing of welds - Ultrasonic testing - Use of automated phased array technology

Non-destructive testing of welds - Phased array ultrasonic testing (PAUT) - Acceptance levels

Non-destructive testing of welds - Ultrasonic testing - Use of automated phased array technology for thin-walled steel components

Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method