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IEC 25/ISO/ FDIS 17760-101
Information technology - AT Attachment 8 - Part 101: ATA/ATAPI Set (ATA8-ACS)
IEC 25/N1673/NP
NWIP for information technology - AT Attachment 8 - ATA/ATAPI Command Set (ATA8-ACS)
IEC 25/N1871/NP
Information technology - AT Attachment 8 - ATA/ATAPI Command Set (ATA8-ACS)
IEC 25/N1872/CD
Information technology - AT Attachment 8 - Part 101: ATA/ATAPI command set (ATA8-ACS)
IEC 91/378/NP
IEC 61190-1-6: Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications
IEC 91/379/NP
IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly
IEC 111/303/CDV
IEC 62321 2nd Edition - Determination of certain substances in electrotechnical products - Part 6: Polybrominated biphenyls and polybrominated diphenyl ethers in polymers by gas chromatography-mass spectrometry (GC-MS), Ion Attachment Mass Spectrometry (IAMS) and High Pressure Liquid Chromatography - Ultra Violet detection (HPLC-UV)
ISO/IEC 25/N972/NP
NWIP on ISO/IEC xxxx: Information technology - AT Attachment with packet interface-7 (ATA/ATAPI-7)
ISO/IEC 17760-302
Information technology - AT Attachment - Part 302: Zoned Device ATA Command Set-2-(ZAC-2)
IEC 91/407/NP
IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips)
