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DIN EN IEC 60749-22-1
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods
Project
DIN EN IEC 60749-22-2
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
Project
DIN EN ISO 18227
Environmental solid matrices - Determination of elemental composition by X-ray fluorescence spectrometry (ISO/DIS 18227:2024); German and English version prEN ISO 18227:2024
