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CSA C22.2 No. 248.13
Low-voltage fuses - Part 13: Semiconductor fuses (Trinational standard with UL 248-13 and NMX-J-009/248/13-2022-ANCE)
Edition
2022-03-01
CSA C22.2 No. 60947-4-2
Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor- starters - AC semiconductor motor controllers and starters (Binational standard with UL 60947-4-2)
Edition
2022-05-01
IPC EIA J-STD-026
Semiconductor Design Standard for Flip Chip Applications
Edition
1999-08-01
ISO/TR 23247-100
Automation systems and integration - Digital twin framework for manufacturing - Part 100: Use case on management of semiconductor ingot growth process
Edition
2025-05
OEVE/OENORM EN 60191-2
Mechanical standardization of semiconductor devices - Part 2: Dimensions (IEC 47D/406A+407A+408A+410A+411A+418/CDV)
Edition
2001-04-01
OEVE/OENORM EN 60191-6-1
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/804/CDV)
Edition
2011-08-01
OEVE/OENORM EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/781/CDV)
Edition
2010-11-01
OEVE/OENORM EN 60191-6-7
Mechanical standardization of semiconductor devices - Part 6-7: General rules for the dimensions of P-QFN (IEC 47D/534/CDV)
Edition
2003-05-01
OEVE/OENORM EN 60191-6-11
Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA) (IEC 47D/482/CDV)
Edition
2002-03-01
OEVE/OENORM EN 60749-28
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) (IEC 47/2155/CDV)
Edition
2013-04-15