Space systems. Thermal control coatings for spacecraft. Atomic oxygen protective coatings on polyimide film
Edition 2021-10-29

Plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheets 4: Polyimide films used for electrical insulation (Endorsed by Asociación Española de Normalización in October of 2022.)
Edition 2022-10-01

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
Edition 1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
Edition 1996-10-16

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
Edition 1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
Edition 1996-10-14

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 16: POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
Edition 1997-07-15

Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
Edition 2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
Edition 1997-08-11

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
Edition 2001-12-31