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NF C93-711-6-3 ; NF EN IEC 61188-6-3:2025-01-31
Circuit boards and circuit board assemblies - Design and use - Part 6-3 : land pattern design - Description of land pattern for through hole components (THT)
Edition
2025-01-31
OVE EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1878/CDV) (english version)
Edition
2023-10-01
UNE-EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition
2021-04-01
UNE-EN IEC 61188-6-4
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
Edition
2019-08-01
UNE-EN IEC 61188-6-1
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
Edition
2021-05-01
UNE-EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)
Edition
2025-03-01
IPC 7352
Generic Guideline for Land Pattern Design
Edition
2023-05-01
DIN EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition
2022-04
IPC 7351B
Generic Requirements for Surface Mount Design and Land Pattern Standard
Edition
2010-06-30
DIN EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
Edition
2023-03
