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OEVE/OENORM EN 61193-5
Soft soldering - Part 5: Registration and analysis of defects on printed board assemblies (IEC 91/182/CDV)
Edition
2000-03-01
OVE EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV) (english version)
Edition
2024-11-01
ABNT NBR 7190-3
Timber Structures Part 3: Test Methods for characterization of defect-free specimens for timber of native forests
Edition
2022-06-29
ABNT NBR 13484
Fabrics - Classification method based on defect scoring inspection
Edition
2025-03-18
NF B43-410-2 ; NF ISO 5618-2:2024-05-22
Fine ceramics (advanced ceramics, advanced technical ceramics) - Test method for GaN crystal surface defects - Part 2: method for determining etch pit density
Edition
2024-05-22
PR NF C93-733-302 ; PR NF EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302 : detection of plating defects in unpopulated circuit boards by computed tomography (CT)
24/30488393 DC
BS ISO 4149 Green coffee - Olfactory and visual examination and determination of foreign matter and defects
Edition
2024-09-24
24/30488910 DC
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Edition
2024-03-08
24/30497109 DC
BS EN IEC 63068-5 Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices. Part 5. Test method for defects using X-ray topography
Edition
2024-07-12
24/30499009 DC
BS IEC 63581-1 Semiconductor devices - The recognition criteria of defects in polished indium phosphide wafers. Part 1: Classification of defects
Edition
2024-08-16