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DIN EN 16603-20-40
Space engineering - ASIC, FPGA and IP Core engineering; English version EN 16603-20-40:2023
Edition
2024-02
DIN SPEC 19289
Fibre-reinforced composites - Measurement of Interfacial Shear Strength by means of a Micromechanical Single-Fibre Pull-Out Test; Text in English
Edition
2022-08
BS EN 62047-25
Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
Edition
2016-11-30
NF C96-050-25 ; NF EN 62047-25:2016-12-30
Semiconductor devices - Micro-electromechanical devices - Part 25: silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Edition
2016-12-30
SN EN 62047-25
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Edition
2016-11
UNE-EN 62047-25
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
Edition
2017-01-01
