Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
Edition 2002-09

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001)
Edition 2002-12-01

Water main and water distribution systems - PVC-U 6,3 plastic pipes and fittings with elastic joints and with nominal diameter until DN 100 Part 2: Specific requirements for pipes with nominal pressure PN 1,00 MPa
Edition 2019-04-30

Mechnical standardization of semiconductor devices - Part 6-2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Edition 2002-08-01

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Edition 2002-03-29

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Edition 2003-10-10

Energy performance of buildings - Energy needs for heating and cooling, internal temperatures and sensible and latent heat loads - Part 3: Calculation procedures regarding adaptive building envelope elements - Amendment 1: Reference control scenarios for adaptive building envelope elements with active solar shading or chromogenic glazing (ISO 52016-3:2023/DAM 1:2024); German and English version EN ISO 52016-3:2023/prA1:2024
Edition 2025-02

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
Edition 2008-07

Wrought nickel alloys with chromium - Chemical composition
Edition 2020-12

Heat resistant steel castings; German version EN 10295:2002
Edition 2003-01