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Standards [CURRENT]

DIN EN IEC 60172 ; VDE 0474-172:2022-04

Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires (IEC 60172:2020); German version EN IEC 60172:2021
Edition 2022-04

Standards [CURRENT]

DIN EN 60188

High-pressure mercury vapour lamps - Performance specifications (IEC 60188:2001); German version EN 60188:2001 + A11:2019
Edition 2019-10

Standards [CURRENT]

DIN EN IEC 60191-1

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
Edition 2018-10

Standards [CURRENT]

DIN EN 60191-3

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
Edition 2000-07

Technical rule [CURRENT]

DIN EN 60191-3 Beiblatt 1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
Edition 2006-08

Standards [CURRENT]

DIN EN 60191-4

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02

Standards [CURRENT]

DIN EN 60191-6

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
Edition 2010-06

Standards [CURRENT]

DIN EN 60191-6-1

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
Edition 2002-08

Standards [CURRENT]

DIN EN 60191-6-2

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
Edition 2002-09

Standards [CURRENT]

DIN EN 60191-6-3

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
Edition 2001-06

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