NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 60454-1 | 1994-08 | Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements (IEC 60454-1:1992) More |
| EN 60454-3-1 | 1998-04 | Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive (IEC 60454-3-1:1998) More |
| EN 60584-1 | 1995-10 | Thermocouples - Part 1: Reference tables (IEC 60584-1:1995) More |
| EN 60695-11-5 | 2005-03 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance (IEC 60695-11-5:2004) More |
| EN 61188-1-2 | 1998-08 | Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance (IEC 61188-1-2:1998) More |
| EN 61189-1 | 1997-04 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997) More |
| EN 61190-1-1 | 2002-06 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002) More |
| EN 61190-1-2 | 2007-06 | Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2007) More |
| EN 62326-4 | 1997-01 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification (IEC 62326-4:1996) More |
| EN 62326-4-1 | 1997-01 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C (IEC 62326-4-1:1996) More |
