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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/UK 631.4

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Document number	Begin	Title	Comment
DIN EN IEC 63378-3	2025-04-23	Thermal standardization on semiconductor packaging - Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis More	Comment
DIN EN IEC 63378-6	2025-04-23	Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points More	Comment
DIN EN IEC 63378-6-1	2024-09-05	Model creation method using a datasheet of semiconductor device More	Comment
DIN EN IEC 63378-2-2	2024-09-05	3D thermal simulation models of PBGA and FBGA packages for steady-state analysis More	Comment
DIN EN IEC 63378-4	2024-09-05	Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages More	Comment
IEC 47D/787/CD	2010-11-19	IEC 60191-2/f66 Ed.1: Proposed new package outline - large power package with 4 load terminals, P-UMP-A4. To be published as outline 184B, if approved. More	Comment
IEC 47D/817A/CDV	2010-11-19	IEC 60191-2 f67 Ed.1: Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved. More	Comment
IEC 47D/818/CDV	2010-11-19	IEC 60191-2 f68 Ed.1: Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F, if approved. More	Comment
IEC 47D/819/CDV	2010-11-19	IEC 60191-2 f69 Ed.1: Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved. More	Comment
IEC 47D/782/NP	2010-08-27	(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) More	Comment

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