Projekt
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
Beginn
2013-02-22
Geplante Dokumentnummer
IEC 47F/149/CD
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
